151-00927 FIR TREE C-CLIP, .24"–.30" BUNDLE DIA, .03"–.25" PANEL, .26" MNT HOLE, PA66HIRHSUV, BLACK, 100/PKG

Kimball Electronics Inc

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Specification
Value

Bundle diameter max imperial

0.29 ""

Bundle diameter max metric

7.6 mm

Bundle diameter min imperial

0.24 ""

Bundle diameter min metric

6.0 mm

Color

Black (BK)

Coo

US

Height h imperial

1.32 ""

Height h metric

33.43 mm

Hts

3926909987

Material

Polyamide 6.6 high impact modified, heat and UV stabilized (PA66HIRHSUV)
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